Modular point-of-purchase (POP) display

ABSTRACT

There is described is described a modular point-of-purchase display, system and method. The modular point of purchase display includes a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf. A printed electronic device is affixed to a surface of the back wall, the front wall, the bottom wall, the at least one side wall, and the at least one shelf. The display includes a microcontroller electrically coupled to the printed electronic device. The display includes a power supply electrically coupled to the printed electronic device. The display includes a connection device coupled to the printed electronic device. The display includes a modular component coupled to the connection device, wherein the modular component can be removed and replaced with an alternate modular component compatible with the connection device.

CROSS REFERENCE TO RELATED APPLICATIONS

This application relates to commonly assigned co-pending applicationSer. No. 16/265,196, POINT-OF-PURCHASE DISPLAY, filed simultaneouslyherewith and incorporated by reference herein.

BACKGROUND Field of Use

The disclosure herein is directed to point-of-purchase (POP) displaysand systems.

Background

Brand owners and manufacturers produce cardboard/paperboard marketingdisplays know as Point-of-Purchase (POP) displays to be deployed instores. These displays are often temporary and typically placed in highcustomer traffic areas or at the end of an aisle. POP displays arecommonly used to promote a new product, a new product feature, seasonalproducts and combo packs. POP displays have been shown to boost saleswhen compared to the same product being on a regular store shelf. Bothbasic and elaborate displays with unique designs and printed imagery areused to catch the attention of consumers. These displays increaseproduct visibility, impulse purchases and help highlight specificproducts.

An important distinction to make is the difference between a POP displayand a Point of Sale (POS) display. A POS display promotes products atthe exact space where purchases can be made, while at a POP display,purchase cannot be made, one can only learn about the product promoted.

Traditionally POP displays utilize graphics and unique display designsto attract customer interest. The incorporation of electronics into POPdisplay is not commonly utilized. Some examples of complex POP displaysincorporating electronics can be found. However, these displays usewiring to connect to traditional electronic circuit boards drivingfunctionality. A custom display design and custom wiring must be used tomake each display which is costly and time consuming A need exists for auser friendly method to create ‘smart’ POP displays with easilycustomizable and replaceable components.

SUMMARY

In one aspect, there is described a modular point-of-purchase display.The display includes a back wall and a front wall, a bottom wall, atleast one side wall, and at least one shelf. A printed electronic deviceis affixed on a surface of the at least one the shelf, the bottom wall,the side wall, the back wall or the front wall. The printed electronicdevice is selected from the group consisting of: wires, insulators,resistors, capacitors, inductors, transformers, transistors, antennas,OLEDs and sensors. A microcontroller electrically is coupled to theprinted electronic device. A power supply is electrically coupled to theprinted electronic device. A connection device is coupled to the printedelectronic device. A modular component is coupled to the connectiondevice, wherein the modular component can be removed and replaced withan alternate modular electronic component compatible with the connectiondevice.

In another aspect, there is provided, a method of manufacturing modularpoint-of-purchase display. The method includes providing a plurality ofsheets forming a back wall and a front wall, a bottom wall, at least oneside wall, and at least one shelf. The method includes affixing aprinted electronic device on a surface at least one of the plurality ofsheets, wherein the printed electronic device is selected from the groupconsisting of: wires, insulators, resistors, capacitors, inductors,transformers, transistors, antennas, OLEDs and sensors. The methodincludes assembling the back wall, the front wall, the bottom wall, theat least one side wall or the at least one shelf. The method includesaffixing a connection device on a surface at least one of the back wall,the front wall, the bottom wall, the at least one side wall or the atleast one shelf, the connection device coupled to the printed electronicdevice. The method includes connecting at least one modular electroniccomponent to the connection device, wherein the at least one modularcomponent can be removed a replaced with a second modular componentcompatible with the connection device. The method includes coupling amicrocontroller to the printed electronic device. The method includescoupling a power supply to the printed electronic device.

In another aspect, there is provided a modular point-of-purchase displaysystem. The system includes a back wall and a front wall, a bottom wall,at least one side wall, and at least one shelf. The system includes aprinted electronic device affixed on a surface of the at least one theshelf, the bottom wall, the side wall, the back wall or the front wall.The printed electronic device is selected from the group consisting ofwires, insulators, resistors, capacitors, inductors, transformers,transistors, antennas, OLEDs and sensors. The system includes amicrocontroller coupled to the printed electronic device. The systemincludes a power supply coupled to the printed electronic device. Thesystem includes a connection device coupled to the printed electronicdevice. The system includes a plurality of modular components that canbe operably coupled to the connection device.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate several embodiments of thepresent teachings and together with the description, serve to explainthe principles of the present teachings.

FIG. 1 is a depiction of an empty POP display according to embodimentsof the disclosure.

FIG. 2 is a depiction of an POP display having sale items displayedaccording to embodiments of the disclosure.

FIG. 3 is a depiction of an POP display having electronic componentsaccording to embodiments of the disclosure.

FIG. 4 is a cross-sectional of a pressure sensitive adhesive film for aPOP display according to embodiments of the disclosure.

FIG. 5 is a depiction of a pressure sensitive adhesive film havingprinted electronics according to embodiments of the disclosure.

FIG. 6 is a depiction of a substrate sheet having printed electronicsaccording to embodiments of the disclosure.

FIG. 7 is a depiction of assembled sheets for a POP display havingprinted electronics according to embodiments of the disclosure.

FIG. 8 is a schematic data flow diagram illustrating connections betweenelectronic components in a POP display according to embodiments of thedisclosure.

FIG. 9 shows a flow chart illustrating a method according to variousembodiments of the disclosure.

It should be noted that some details of the FIGS. have been simplifiedand are drawn to facilitate understanding of the embodiments rather thanto maintain strict structural accuracy, detail, and scale.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to embodiments of the presentteachings, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts.

In the following description, reference is made to the accompanyingdrawings that form a part thereof, and in which is shown by way ofillustration specific exemplary embodiments in which the presentteachings may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice thepresent teachings and it is to be understood that other embodiments maybe utilized and that changes may be made without departing from thescope of the present teachings. The following description is, therefore,merely illustrative.

Illustrations with respect to one or more implementations, alterationsand/or modifications can be made to the illustrated examples withoutdeparting from the spirit and scope of the appended claims. In addition,while a particular feature may have been disclosed with respect to onlyone of several implementations, such feature may be combined with one ormore other features of the other implementations as may be desired andadvantageous for any given or particular function. Furthermore, to theextent that the terms “including”, “includes”, “having”, “has”, “with”,or variants thereof are used in either the detailed description and theclaims, such terms are intended to be inclusive in a manner similar tothe term “comprising.” The term “at least one of” is used to mean one ormore of the listed items can be selected.

Notwithstanding that the numerical ranges and parameters setting forththe broad scope of embodiments are approximations, the numerical valuesset forth in the specific examples are reported as precisely aspossible. Any numerical value, however, inherently contains certainerrors necessarily resulting from the standard deviation found in theirrespective testing measurements. Moreover, all ranges disclosed hereinare to be understood to encompass any and all sub-ranges subsumedtherein. For example, a range of “less than 10” can include any and allsub-ranges between (and including) the minimum value of zero and themaximum value of 10, that is, any and all sub-ranges having a minimumvalue of equal to or greater than zero and a maximum value of equal toor less than 10, e.g., 1 to 5. In certain cases, the numerical values asstated for the parameter can take on negative values. In this case, theexample value of range stated as “less than 10” can assume negativevalues, e.g. −1, −2, −3, −10, −20, −30, etc.

Although embodiments of the disclosure herein are not limited in thisregard, the terms “plurality” and “a plurality” as used herein mayinclude, for example, “multiple” or “two or more.” The terms “plurality”or “a plurality” may be used throughout the specification to describetwo or more components, devices, elements, units, parameters, or thelike. For example, “a plurality of resistors” may include two or moreresistors.

When an element is referred to as being “on”, “engaged to”, “connectedto” or “coupled to” another element, it may be directly on, engaged,connected or coupled to the other element, or intervening elements maybe present. In contrast, when an element is referred to as being“directly on,” “directly engaged to”, “directly connected to” or“directly coupled to” another element or layer, there may be nointervening elements present. Other words used to describe therelationship between elements should be interpreted in a like fashion(e.g., “between” versus “directly between,” “adjacent” versus “directlyadjacent,” etc.). As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

Disclosed herein is a modular approach to making smart POP displaysutilizing printed or hybrid electronics. To add electronics to a POPdisplay, a series of common components are required along with ancillarycomponents to add increased functionality. The disclosure hereinprovides a common base of components where ancillary components can bechosen by the POP display designer to achieve the desired effectallowing for the creation of unique ‘smart’ POP displays. Meanwhileperipherals such as a monitor, a keyboard, a mouse, graphics cards,software, network cards, etc., all enhance the experience but are notrequired.

The disclosure herein provides a simplified approach to generate a‘smart’ POP display allowing people such as sales and marketingcompanies' access to electronic components. The disclosure hereinprovides a generic base design to create a ‘smart’ display where thedesired functionality can be added or altered by switching certaincomponents. By utilizing printed electronics or hybrid electronics, someor all of the electronic components can be added to each POP display.When assembling the POP display, these electronics all connect to acontroller, microcontroller or master control module to create afunctional POP display. The disclosure herein allows sales and marketingcompanies' access to electronic technology they did not realize waspossible, at a reduced cost.

FIG. 1 shows a POP display 10. The blank POP display 10 is made of apaperboard or a corrugated cardboard substrate. Other suitablesubstrates for the POP display include wood, metal and acrylic. Thesubstrate is in flat sheet form, that is, it can be packed flat. Thesheets for the POP displays are folded and assembled through insertioninto perforations to create the POP display 10. Instructions on foldingand assembly are included with the flat sheets. The POP display includesat least one shelf 11, at least one of a bottom wall 12, at least oneside wall 13, a back wall 14 and a front wall 15. The back wall 14 andfront wall 15 can be opposite sides of the same sheet of substrate. ThePOP display 10 is typically shipped flat and the various components, thefront and back wall (14 and 15), the bottom wall 12, the side walls 13and shelves 13 are assembled on site.

FIG. 2 shows the assembled POP display 10 with items 24 that aredisplayed for promotion and sale on the shelves 11 and bottom wall 12(FIG. 1).

FIG. 3 show the POP display 10 with products for sale removed. The POPdisplay 10 includes a customer interaction device 34 provided on thefront wall 15 (FIG. 1). A modular component such as a customerinteraction device 34 can include a motion sensor that detects acustomer. Customer interaction devices include buttons for the customerto push, a wireless communication method (e.g. blue tooth low energy(BLE), Near Field Communication (NFC), Radio Frequency IdentificationDevice (RFID), Wifi,) to interact with a customer's mobile device, anoptical sensor or camera to detect a customer. As an example, when thecustomer is detected by a motion sensor at the POP display, a speakercan begin talking to the customer. A controller 30 and power supply 31are coupled to the customer interaction device 34. In addition, the POPdisplay 10 can include other modular components, such as LEDs 37. ThePOP display can include a screen (such as an LCD screen) providingproduct information, wireless communication with a mobile device (e.g.blue tooth low energy (BLE), NFC, RFID, Wifi,), sensors such as touchsensors, temperature and humidity to provide information about theenvironment or items on the display etc. The LEDs 37 and other modularcomponents are coupled to the microcontroller 30 and power supply 31.The POP display can include other modular components, such as weightsensors 36 that indicate when sales products are removed from theshelves 11 or bottom wall 12 (FIG. 1). Capacitive object sensing, RFIDobject detection, light sensors, optical sensors can also indicate whenproducts are removed from the shelves.

The modular electronic components such as the customer interactiondevice 34, display outputs 37 and sensors 36 are coupled to themicrocontroller 30 and power supply 31 through printed electronics, suchas conductive traces. The printed electronics are applied directly tothe substrate. Along with the printed electronics, printed graphics canalso be applied to the substrate. The application of printed electronicscan occur on the substrate while it is flat. The application of theprinted electronics and printed graphics can occur prior to perforation,cutting or folding of the substrate. Certain modular components such alights can then be added to the display after the POP display 10 isassembled.

Printed electronic devices can also be printed on pressure sensitiveadhesive film. Pressure sensitive adhesive films with graphic designsprinted on thereon are compatible with many types of substrates.

Pressure sensitive adhesive films having the printed electronics includeprinted smart tags. Printed smart tags include functionality such asmoisture sensing and NFC communication. These tags are usually attachedto each package for individual item monitoring.

FIG. 4 shows a cross-sectional view of a pressure sensitive adhesivefilm 95, according to various embodiments having a printed conductivetrace 91 forming a printed electronic device. The pressure sensitiveadhesive film 95 includes a backing layer 94. Disposed on the backinglayer 94 is the pressure sensitive adhesive 93. Disposed on the pressuresensitive adhesive 93 is a surface wrap material 92. A conductive trace91 forming a printed electronic device is disposed on the surface wrapmaterial 92. Application of the pressure sensitive adhesive film 95 to asurface of one of the plurality of sheets for the POP display isaccomplished by removing the backing layer 94 and placing the pressuresensitive adhesive film 95 where desired. This is done when the sheetsof the POP display are flat and prior to shipping of the flat sheets.

Applying pressure sensitive adhesive film with printed electronics toshelves allows for inventory control or shopper interaction systems byincorporating various technologies onto shelves, including proximitysensors, cameras, microphones, RFID readers, and weight sensors. Usingpressure sensitive adhesive film with printed electronics and modularelectronic components provides a cost-effective option for replaceableshelves.

Pressure sensitive adhesive films, as a low-cost wrapping layer, allowfor easy combination of electronic and graphic components, providing anattractive approach for smart POP display design and fabrication.

The utilization of pressure sensitive adhesive films is an easy andversatile way to integrate modular electronic components onto POPdisplays. The pressure sensitive adhesive film is compatible withroll-to-roll printing for both conductive inks and traditional graphicinks. Conductive trace patterns are designed using computer software anddeposited onto the pressure sensitive adhesive film through digital oranalog printing techniques. As the pressure sensitive adhesive film canstick to numerous types of substrates, it overcomes the limitation ofpoor ink adhesion and low melt temperature plastics. Connecting amicrochip or other modular electronic component to the printedconductive traces on the pressure sensitive adhesive in areas ofinterest on the POP display allows for the incorporation offunctionality such as LED indicators, digital price tags, temperaturesensors, etc.

To add aesthetic and informative elements to the POP displays, graphicscan be printed onto the pressure wrap material 92 before or after theconductive traces 91 forming the printed electronic device are depositedon the surface wrap material 92 of the pressure sensitive adhesive film95. The pressure sensitive adhesive film 95 is compatible with massproduction processes such as roll-to-roll printing.

A fabrication process of printing electronic devices on pressuresensitive adhesive film 95 and using it as a wrapping layer to build aPOP display is disclosed herein. The ability to accommodate bothconductive and graphic inks makes the pressure sensitive adhesive usefulfor a POP display. The pressure sensitive adhesive film expands therange of feasible substrate materials by 1) preventing inkincompatibility issues and 2) by enabling direct application of adhesivefilms onto non-planar POP display surfaces. Through digital printingmethods, smart display prototypes can be created in a quick manner,while the mass production techniques such as roll-to-roll printingenable the low-cost manufacturing of functional pressure sensitiveadhesive films in large quantities.

Electronics can be printed directly on certain substrates such assurface wrap material 92 of the pressure sensitive adhesive film 95 orsurfaces of the sheets forming the POP display, such as cardboard, woodacrylic or metal. The electronics are flexible conductive materials,such as, silver (Ag), gold (Au), carbon (graphene, carbon nanotubes,graphite or carbon black).

The flexible conductive materials can be printed on surface wrapmaterial 92 of the pressure sensitive adhesive films 95 or othersubstrates to produce the following printed electronic devices; wires orconductive traces, capacitors, (where a dielectric material is depositedbetween conductive parallel plates), inductors (conductive material isprinted a spiral type pattern), transformers (conductive materialprinted in two overlapped or interlaced spirals), transistors (minimum 3material device with printed conductor, printed dielectric and printedsemiconductor). A voltage applied to the gate changes the current acrossthe transistor (usually multiple orders of magnitude). The printedelectronics on the substrate or pressure sensitive adhesive film alsoinclude resistors (a conductive material with a set resistance isprinted (typically carbon materials with another filler)), antennas,(conductive material printed in a specific pattern to receive orresonate at a desired frequency and sensors (two plates of conductivematerial printed with a sensing material between the two plates. Anexample sensor could measure the current between the plates as acondition changes such as temperature or humidity (the resistance of thesensing material changes causing the current to change). The printedelectronic devices include wires, insulators, resistors, capacitors,inductors, transformers, transistors, antennas, printed battery, organiclight emitting diodes (OLEDs) and sensors.

The use of printed electronic devices eliminates the need for loosewires hanging from or hidden within the POP display. The flexibleconductive material allow for folding of the substrate in the POPdisplays without losing the conductivity for the printed electronics.The POP display can be shipped flat and assembled by the user.Traditional pick and place techniques can allow for the addition ofmodular components such as LEDs, certain antennas, certain sensors andmicrochips, integrated circuits (IC), resistors, capacitors, powersupply, diodes, transistors, inductors, sensors, transducers, switchesand transformers. Fabrication of a system involves the physical designof a POP display. Graphics design and placement of electronics,including modular components, are determined through a design program.Printing of the graphics and printed electronics occurs on the substrateof the POP display before it is cut, perforated and/or folded. Printingof the graphics and application of a pressure sensitive adhesive filmhaving printed electronics occurs on the substrate of the POP displaybefore it is cut, perforated and/or folded. Surface mount electronicsare then be added to the POP display. A controller or microcontroller isprogrammed before or after being added to the POP display.

Printing of the electronics on a substrate or surface wrap material 92of the pressure sensitive adhesive film 95 can be accomplished by usinganalogue or digital print techniques such as gravure, flexography,inkjet printing, screen printing, aerosol jet printing, extrusionprinting, and other established print techniques to apply the flexibleconductive materials to the substrate or the pressure sensitive adhesivefilm. The disclosure herein is compatible with established manufacturingtechniques.

The form factor of pressure-sensitive adhesive film 95 is compatiblewith industrial manufacture processes such as roll-to-roll printing.Because the pressure sensitive adhesive film 95 is wrapped on to the POPdisplay, the form factor of the display does not need to be altered toallow for the addition of electronics. The pressure sensitive adhesivefilms 95 with conductive traces 91 forming printed electronic devicescan be handled flat and can be folded, making them easy to ship andassemble. The pressure sensitive adhesive film 95 having a printedelectronic device can be directly wrapped onto surfaces. The pressuresensitive adhesive film 95 has good adhesion to numerous types ofsubstrates, even those incompatible with the conductive inks or printingprocesses. Graphics can be easily printed onto the surface wrap material92 of the pressure sensitive adhesive film 95 to provide information anddecoration.

Utilizing flexible conductive materials, such as inks of Ag, Cu, Au orcarbon (graphene, carbon nanotubes, graphite and carbon black) for theprinted electronics removes the need for wiring after assembly of thePOP display.

Connection devices for the modular components include low temperaturesolder having a melting temperature of from 138° C. to 188° C. orconductive adhesive. A pogo pin connector or a magnetic connector canalso be coupled to the printed electronics and serve as a connectiondevice or a cable connector can also be couple to the printed electronicdevices and serve as a connection device. The connection device allowsfor the modular components to be connected through the printedelectronics to the power supply and controller.

A controller can connect to the printed electronics to form a completedPOP display. The controller can use a wired or wireless connection suchas bluetooth, Zigbee, WiFi, Long Range Wide Area Network (LoRaWAN),Global System for Mobile communications (GSM) etc., to connect to acentral control unit or a mobile device. Connection to the controllercan allow for the display to be updated, upload gathered data to thecentral hub and or interact with mobile devices. It can also allow onecentral control unit to interact with multiple electronic components.Electronic components such as buttons, touch sensors, lights/LEDs/OLEDs,antenna, audio and other components can also be printed or attachedusing surface mount technology.

FIG. 5 shows screen printed circuitry 41 on pressure sensitive adhesivefilm 40. The screen printed on the pressure-sensitive adhesive film 40is affixed to a substrate 50 of a POP display in FIG. 6. The pressuresensitive adhesive film 40 includes connection points 51 for coupling,other conductive traces or connection devices for the modular electriccomponents, power supply or controller to the pressure sensitiveadhesive film. FIG. 7 shows the back wall 14 of an assembled POP displayhaving pressure-sensitive adhesive film 40 includes connection points51. A controller 60 is coupled to the printed circuitry 41 on thepressure sensitive adhesive film 40. The shelf insert 62 is shown inFIG. 7.

The POP display disclosed herein can utilize a central controller. Fromit a set of components can be added to provide the features desired.Power can be supplied either from a wired connection, an on boardbattery (cell or thin film) or wirelessly. The POP display can includetraditional graphics and graphic based interactions such as barcodes, QRcodes and Digimarc, and will also contain a base set of printedelectronics on pressure sensitive adhesive film and add on modularelectronic components.

The base components common to all designs to develop a modular displaywill include: a controller or microcontroller; a power supply, such as acabled connection, battery, thin film battery, or wireless energy andprinted electronics as described above. Connection devices are used forcoupling modular components to the printed electronics. The printedelectronics connect the modular components on the POP display and thecontroller.

The connection protocol to connect the controller or other modularcomponents to the printed electronics on the pressure sensitive adhesivefilm includes, pogo pin connection, magnetic connection, cableconnector, low temperature solder having a melting temperature of from138° C. to 188° C., conductive adhesive, ribbon cable. The modularcomponents and connection device can be shipped separately from the flatsheets of the POP display or provided by the customer on site.

The POP display can have the capability to swap electronic components bychanging only a portion of the POP display where the components arelocated. For example, the folding POP display can contain removableshelves. Each shelf can be changed for a different shelf of the sameform factor but containing different electronic components. It will thenconnect in the back of the system to the controller or microcontrollerand perform a new function. As long as the new electronic components arecompatible with the controller or microcontroller, the new shelf canfunction.

An example of this would be a shelf with 6 red LED indicator lights. Tochange the color of the lights, the shelf could be removed and a newshelf inserted with a new color combination of LED lights such as 3green and 3 blue.

Another example can include a shelf providing capacitive object sensing.This shelf can be removed and replaced by a shelf liner containingoptical object sensing.

FIG. 8 provides a schematic data flow diagram for a POP display showinghow a wide variety of electronics can be integrated in the system.Choosing a control module that can accommodate a number of outputs suchas, sensors audio display screens etc. This design allows for a user tocustomize which electronics one wants on their display. If there is adesire to change a component for another, the entire display does notneed to be redesigned. Instead only the component that has theelectronics to be switched out needs to be reprinted and swapped in onthe display.

FIG. 9 shows a flow chart illustrating a method performed according tovarious embodiments. The processes can be performed in different orders.As shown, the method can include the following processes:

Process P1: Physical design and layout of POP display. The physicaldesign of the POP display includes the shape of the sidewalls andfront/back wall, the bottom wall and shelves. The physical designincludes how the flat sheets of the sidewalls, front/back wall, thebottom wall and shelves are folded and assembled.

Process P2: Design of graphics for POP display. The graphic designincludes where and what graphics to apply to the surfaces of thesidewalls and front/back wall, the bottom wall and shelves.

Process P3: Design of electronics for POP display. The design of theelectronics includes where to place the printed electronics, connectiondevices, modular electronic components, microcontroller, and powersupply. The design of the electronics includes where to print theelectronics or apply a pressure sensitive adhesive film that are used tocouple the connection devices, modular electronic components,microcontroller, and power supply.

Process P4: The graphics are printed on the substrate surfaces of thesidewalls and front/back wall, the bottom wall and shelves.

Process P5: The electronics are printed on the sidewalls and front/backwall, the bottom wall and shelves. In embodiments, electronics areapplied using a pressure sensitive adhesive film on the sidewalls andfront/back wall, the bottom wall and shelves.

Process P6: The POP display is assembled by folding and placing thesidewalls and front/back wall, the bottom wall and shelves in theassembled configuration. The assembly is performed on site.

Process P7: The connection device, modular components, microcontrollerand power supply are attached to the assembled POP display. Themicrocontroller is powered up. A central control unit can update themicrocontroller on POP display for how it is to interact.

Example Interactions with a Smart POP Display

Some examples of POP display designs and interactions are disclosedherein. When there is no communication to a processor, a customerinteracts with the interaction point on the POP display, inputting theirproduct preferences (e.g. a coffee stand with the selections dark roast,Colombian coffee, etc.). The microcontroller on the POP display outputsa signal to light up LED(s) for products corresponding to the customerschosen preferences. A customer taps a point on the unit stating theywant to know more about a product. The POP display then wirelesslyinteracts with their mobile device providing additional productinformation.

When there is communication of the POP display with a central controlunit. The central control unit contains a customer interaction pointsuch as a touch panel or screen. Once the customer has input theirsettings (e.g. a coffee stand with the selections dark roast, Colombiancoffee, etc.), the central control unit wired or wirelessly communicatesto the POP display to indicate which items on the POP display meet thesecriteria by a simple method such as turning on an LED. The centralcontrol unit can update the microcontroller on the display to indicateto store employee(s) which products on the POP display need to bechanged to new inventory. The controller or microcontroller on POPdisplay can communicate with the central hub providing information aboutcustomer interaction with the POP display.

An update can be provided by a central hub to the POP display throughwireless communication to update. The communication is received by thecontroller on the POP display and is updated.

While the embodiments have been described in detail with reference tospecific and preferred embodiments, it will be appreciated that variousmodifications and variations will be apparent to the artisan. All suchmodifications and embodiments as may readily occur to one skilled in theart are intended to be within the scope of the appended claims.

What is claimed is:
 1. A modular point-of-purchase display comprising: aback wall and a front wall, a bottom wall, at least one side wall, andat least one shelf; a printed electronic device comprising a pressuresensitive adhesive film affixed on a surface of the at least one theshelf, the bottom wall, the side wall, the back wall or the front wall,a surface wrap material disposed on the pressure sensitive adhesive filmand at least one conductive trace disposed on the pressure sensitiveadhesive film, wherein the printed electronic device is selected fromthe group consisting of: capacitors, inductors, transformers,transistors, OLEDs and sensors, wherein the at least one conductivetrace is selected from the group consisting of: silver, gold, carbonnanotubes, graphene, graphite and carbon black; a microcontrollerelectrically coupled to the printed electronic device; a power supplyelectrically coupled to the printed electronic device; a connectiondevice coupled to the printed electronic device; and a modularelectronic component coupled to the connection device, wherein themodular component is configured to be removed and replaced with analternate modular component compatible with the connection device. 2.The modular point-of-purchase display according to claim 1, wherein themodular electronic component is selected from the group consisting of: asensor, a light, an antenna, an audio component, a wirelesscommunication device, an integrated circuits (IC), a resistor, acapacitor, a power supply, a diode, a transistor, an inductor, atransducer, a switch and a transformer.
 3. The modular point-of-purchasedisplay according to claim 1, wherein the connection device is selectedfrom the group consisting of: a pogo pin connector, a magneticconnector, a cable connector, a conductive adhesive, a low temperaturesolder having a melt temperature of 138° C. to 188° C., and a ribboncable.
 4. The modular point-of-purchase display according to claim 1,wherein the at least one shelf can be removed and replaced with asecond, distinct shelf.
 5. A method of manufacturing modularpoint-of-purchase (POP) display comprising: providing plurality ofsheets forming a back wall and a front wall, a bottom wall, at least oneside wall, and at least one shelf; affixing a printed electronic devicecomprising a pressure sensitive adhesive film, a surface wrap materialdisposed on the pressure sensitive adhesive film and at least oneconductive trace disposed on the pressure sensitive adhesive film on asurface at least one of the plurality of sheets, wherein the printedelectronic device is selected from the group consisting of: capacitors,inductors, transformers, transistors, OLEDs and sensors, wherein the atleast one conductive trace is selected from the group consisting of:silver, gold, carbon nanotubes, graphene, graphite and carbon black;assembling the back wall, the front wall, the bottom wall, the at leastone side wall and the at least one shelf; affixing a connection deviceon a surface at least one of the back wall, the front wall, the bottomwall, the at least one side wall or the at least one shelf, theconnection device coupled to the printed electronic device; connectingat least one modular electronic component to the connection device,wherein the at least one modular component is configured to be removedand replaced with a second modular component compatible with theconnection device; coupling a microcontroller to the printed electronicdevice; and coupling a power supply to the printed electronic device. 6.The method according to claim 5, wherein the at least one modularelectronic component and the second modular components are selected fromthe group consisting of: a sensor, a light, an antenna, an audiocomponent, a wireless communication device, an integrated circuits (IC),a resistor, a capacitor, a power supply, a diode, a transistor, aninductor, a transducer, a switch and a transformer.
 7. The methodaccording to claim 5, wherein the connection device is selected from thegroup consisting of: a pogo pin connector, a magnetic connector, a cableconnector, a conductive adhesive, a low temperature solder having a melttemperature of 138° C. to 188° C., and a ribbon cable.
 8. The methodaccording to claim 5, wherein the at least one shelf can be removed andreplaced with a second shelf.
 9. The method according to claim 5,wherein the assembling is performed at a location for the POP display.10. A modular point-of-purchase display system comprising: a displayhaving a back wall and a front wall, a bottom wall, at least one sidewall, and at least one shelf; a printed electronic device comprising apressure sensitive adhesive film, a surface wrap material disposed onthe pressure sensitive adhesive film and at least one conductive tracedisposed on the pressure sensitive adhesive film, wherein the printedelectronic device is affixed on a surface of the at least one the shelf,the bottom wall, the side wall, the back wall or the front wall, whereinthe printed electronic device is selected from the group consisting ofcapacitors, inductors, transformers, transistors, OLEDs and sensors,wherein the at least one conductive trace is selected from the groupconsisting of: silver, gold, carbon nanotubes, graphene, graphite andcarbon black; a microcontroller coupled to the printed electronicdevice; a power supply coupled to the printed electronic device; aconnection device coupled to the printed electronic device; and aplurality of modular electronic components that are configure to beoperably coupled to the connection device.
 11. The modularpoint-of-purchase display system according to claim 10, wherein theplurality of modular electronic components is selected from the groupconsisting of: a sensor, a light, an antenna, an audio component, awireless communication device, an integrated circuits (IC), a resistor,a capacitor, a power supply, a diode, a transistor, an inductor, atransducer, a switch and a transformer.
 12. The modularpoint-of-purchase display system according to claim 10, wherein theconnection device is selected from the group consisting of: a pogo pinconnector, a magnetic connector, a cable connector, a conductiveadhesive, a low temperature solder having a melt temperature of 138° C.to 188° C. and a ribbon cable.
 13. The modular point-of-purchase displaysystem according to claim 10, wherein the at least one shelf can beremoved and replaced with a second shelf.